On Tuesday, July 14, Dr. Alessandro Borghese delivered an invited talk at the International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2026), held from July 13–16, 2026.

The talk focused on sensing mold compound deformation and strain during HTRB and H3TRB testing using fiber-optic sensors. The research was applied to power semiconductor diodes as a case study and carried out in collaboration with other members of the OptoPowerlab: Dr. Vincenzo Romano Marrazzo, Dr. Francesco Fienga, and Prof. Breglio.

Reflecting on the experience, Dr. Borghese said:

“What a great experience and a real pleasure to be part of this wonderful conference. The talks were excellent, and the event was very well organized. I would like to thank the IPFA 2026 and ESREF 2025 organizing committees for this wonderful opportunity and for the excellent work they have done in organizing and hosting such outstanding conferences.
Our experiments provided evidence of a correlation between the evolution of leakage current during stress testing and the deformation of the package itself.”

The work highlights the potential of fiber-optic sensing techniques for gaining new insights into the mechanical behavior of electronic packages under demanding environmental and reliability testing conditions.